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Mitsubishi launched new power semiconductor module

12/10/2018 | Author: Autoguide | 0 Comments Back To Home   < Previous News   |   Next news >

Mitsubishi power semiconductor module

Mitsubishi Electric recently launched a new J-Series transfer moulded power semiconductor module (T-PM) mainly for motor drive applications in electric and hybrid vehicles. 
 
This is considered a major step towards making the idea of mass scale shifting to electric vehicles a reality in the country.
 
Automotive components have to meet stringent safety standards, which creates demands for power semiconductor modules that provide greater reliability than modules for industrial equipment. Mitsubishi Electric pioneered the mass production of power semiconductor modules for hybrid vehicles in 1997.
 
The company’s new module is expected to contribute to further compactness, weight reduction and reduced power consumption in inverters for electric and hybrid vehicles. It has some cutting-edge features like reduced inverter size and weight achieved through the extra compact package with high integration. 
 
Another important feature is inverter power-loss reduction supported by low-loss power semiconductor chips. It realises low power-loss EV/HEV inverter designs through the utilisation of sixth-generation IGBT achieving 12 per cent lower collector-emitter saturation voltage compared with the existing J-Series.
 
The new module is automotive-grade high quality and features transfer moulded structure and Mitsubishi Electric’s original Direct Lead Bonding (DLB) structure. Its power-cycle and temperature-cycle life spans are 30 times longer than those of typical industrial power semiconductor modules. 
 

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