Fraunhofer Institute for Photonic Microsystems IPMS has partnered with South Korea-based TSN Lab to develop next-generation real-time connectivity solutions under the “Global Cooperative R&D” funding programme. The collaboration aims to create advanced 10Base-T1S IP cores tailored for automotive and industrial communication applications, addressing the growing need for scalable, reliable and cost-efficient network infrastructures.
The initiative is organised by the Ministry of SMEs and Startups (MSS) and supported by the Korea Technology and Information Promotion Agency for SMEs (TIPA), reinforcing cross-border innovation in semiconductor and connectivity technologies.
Following the successful completion of a six-month Phase 1 preliminary study led by TSN Lab, the project has now progressed into its primary development phase. The initial phase validated the commercial potential of 10Base-T1S technology through extensive requirement assessments conducted with domestic and global automotive manufacturers.
The study also included detailed functional evaluations and performance benchmarking against competing semiconductor solutions, laying the groundwork for the development of next-generation IP solutions designed to support evolving automotive and industrial networking requirements.
Addressing the Future of Automotive and Industrial Connectivity
10Base-T1S is a low-speed Ethernet PHY standard and currently the only Ethernet technology supporting multi-drop connectivity. It is emerging as a key enabler for consolidating fragmented in-vehicle and industrial communication systems, including CAN and LIN networks. By significantly reducing cable complexity, cost, and vehicle weight, 10Base-T1S offers substantial advantages for automotive, industrial automation, and robotics applications.
Fraunhofer IPMS: Enabling Silicon-Proven Innovation
As a globally recognized research institute specializing in ASIC, FPGA, and SoC design, Fraunhofer IPMS brings more than 20 years of experience and over 200 international licenses to the collaboration. The institute will contribute its expertise in advanced microelectronics design, verification, and system integration to accelerate the realization of production-ready IP solutions.
“The continuous advancement of our TSN IP core portfolio is key to scalable, real-time connectivity in automotive and industrial applications. Collaboration with the TSN Lab accelerates the delivery of a robust, silicon proven 10Base T1S IP solution and brings innovation into practical use faster,” says Alexander Noack, Division Director Data Communication and Computing at Fraunhofer IPMS.
Through this collaboration, Fraunhofer IPMS strengthens its commitment to supporting globally competitive semiconductor innovation and fostering cross-border R&D partnerships. The joint project aims to deliver a robust, silicon-proven 10Base-T1S IP solution tailored to the stringent requirements of next-generation automotive and industrial communication systems, with a clear focus on enabling adoption in international markets, including Europe.
